Now that Samsung has announced new DDR3 memory modules it targets the server segment and in a LRDIMM format the company has managed to push the memory density to 32 Gigabyte.
The memory circuits are made with the latest 40 nanometer technology with 4 Gigabit density each. Samsung’s new load-reduced dual-inline memory modules targets servers used for clouds or virtualization and other areas with high memory requirements.
Samsung’s 32GB LRDIMM prototype consists of 72 4Gb DDR3 chips and an additional memory buffer chip to help reduce the load on the memory subsystem by as much as 75 percent.
The new and beefy memory modules will enable 384GB RAM per processor, which in a two-way system can result in a RAM buffer of 768GB. A server with 32GB RDIMM modules can only reach 512GB in a two-way configuration.
The modules operate at 1.35V up to 1.5V, which allows for clock frequencies up to 1,333 MHz.
Price and availability’s not revealed.
