OCZ recently launched a new hybrid cooler for its memory modules called FlexXLC where it combined a passive heatsink with the possibility to use water cooling. This was an interesting solution for those extreme enthusiasts which are using water cooling in general, but now it seems that OCZ has chosen to develop a new design that will be more accessible. It has namely presented its Flexpipe technology using heatpipes to optimize the cooling of the modules. The concept is to move the heat from the memory modules to an extra heatsink one centimeter (1/5″) above the module and let the airflow do the rest. The picture published by DailyTech pretty much says it all.
This should improve the heat removal now that you don’t have to get the airflow down and in-between the modules and we’re eager to see what series of memories OCZ will launch the cooler with. It is said to be a new series and that we should be able to expect a new launch as early as February.
