NAND flash continues to find new markets while the Solid State Disk market seems to be a key to the success. Except from a higher price, the SSDs has one major drawbacks; the storage capacity. Well Toshiba has now announced a new NAND flash technology that could become the remedy for that. Toshiba has simply expanded the regular two dimensions to three, creating a 3D memory cell structure by stacking chips on top of each other, thus creating a bigger circuit with a higher density. Stacking technologies in flash memory development isn’t exactly news, but Toshiba has made progress in this area.
In the end, the only thing that really matters is that Toshiba will be able to produce NAND flash chips with a higher storage density at the same [physical] size as current chips. This makes it possible to create NAND flash devices with more storage, which is certainly needed on the SSD market.
