Samsung has announced that it has started sampling 2Gb 50nm DDR3 chips. The highest density of DDR3 chips today is 1Gb. Samsung says that the new chips should yield 60% more chips in the production process, while each chip is up to 40% more power efficient than current equivalents. These chips could be used to build dual-die packages and modules with up to 16GB capacity, but the most likely is that they will be used to create 4GB SODIMMs for notebooks and 8GB DIMMs for desktops and workstations. Expect products using these chips somewhere around summer 2009.
