VIA har nu visat upp sitt nya Em-ITX format som är utvecklat för ultratunna och fläktlösa system. Formfaktorn är framtagen för att maximalt utnyttja moderkortets yta och ett av knepen man använt är att man fäst styrkretsen, VIA VX800, samt processorn, VIA Nano, på undersidan av kretskortet. Detta har gjort det möjligt att få plats med ytterligare finesser och kontakter på ovansidan av moderkortet vilket utökar användningsområdena för detta minimalistiska system. Man lär inte hitta VIA Em-ITX i allt för många PCs men plattformen kan tänkas dyka upp i allt från bankomater till kassapparater.
Klicka vidare till VIAs pressmeddelande;
Thin, Fanless & Strong, VIA Demos First Em-ITX Board with VIA Nano Processor at ESC Silicon Valley
VIA EITX-3000 brings cool running multi-display performance to the hottest embedded applications
Taipei, Taiwan, 27 March 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, will showcase the VIA EITX-3000 Em-ITX board at ESC Silicon Valley 2009. Designed for ultra-thin, high-performance, fanless embedded systems at temperatures ranging from -10 degrees to 70 degrees Celsius, the VIA EITX-3000 uses unique processor placement to deliver leading performance in hot and cold environments.
The VIA EITX-3000 places the energy-efficient VIA Nano processor and VIA VX800 media system processor on the reverse side of the board, making greater real-estate available for passive cooling apparatus and thus negating the need for system fans. This makes the VIA EITX-3000 an exceptional choice for high performance systems in always-on applications such as high-end POS, Kiosk, ATM, HMI, factory automation, POI and digital signage.
Designed to facilitate hassle-free ultra-thin design of high performance, fanless systems, the VIA EITX-3000 is the first VIA product to use the recently announced Em-ITX form factor specification. Using a choice of either 1.3GHz or 1.0GHz VIA Nano Ultra Low Voltage processor, the VIA EITX-3000 couples industry leading performance-per-watt with a thin, fanless design courtesy of its extensive I/O coastline.
The added horsepower of the VIA Nano processor is supplemented by a full array of features including dual gigabit networking, multi-configurable dual on-board LVDS and a VGA port. Four on-board serial ports can be configured through BIOS selection while an on-board DC-DC power converter with variable power input (DC 7V ~ 36V) supports both AT and ATX modes, configured via onboard switch. For further I/O options, the VIA EITX-3000 can also take advantage of a range of VIA developed EM-IO expansion boards.
“VIA has repeatedly pushed the thermal design envelope with innovative form factor specifications that allow ever more compact, slim and versatile device designs,” said Daniel Wu, Vice President, VIA Embedded, VIA Technologies, Inc. “The VIA EITX-3000 adds the performance-per-watt advantages of the VIA Nano processor to create a truly compelling embedded board for high-end digital media systems”.
Join VIA at ESC Silicon Valley 2009
The VIA EITX-3000 will be shown at ESC Silicon Valley 2009, March 31-April 2, the McEnery Convention Center, San Jose, Booth No. 15109. For more information about VIAs involvement at ESC Silicon Valley please visit:
http://www.via.com.tw/en/company/events/esc2009/index.jsp
About the VIA EITX-3000
Specially designed for fanless implementations in a wide range of temperatures (-10o to 70o C), the VIA EITX-3000 is powered by a choice of the latest 1.0GHz or 1.3GHz VIA Nano processor and VIA VX800 media system processor, supporting up to 2GB of compact DDR2 SO-DIMM system memory. The VIA EITX-3000 includes an on-board DC-DC converter which supports both AT and ATX modes, configurable via an on-board switch.
The VIA VX800 media system processor takes advantage of the integrated VIA Chrome9 HC3 DirectX 9.0c compliant graphics and video controller, which includes MPEG-2, MPEG-4 and WMV9 hardware decoding acceleration for smooth media playback across multiple displays.
Dual, on-board LVDS ports support two 24-bit single channel interfaces with panel resolutions of up to 1280 x 1024. Both LVDS ports can offer independently configured resolutions and refresh rates in combination with an on-board VGA port supporting resolutions up to 1920 x 1440.
Networking includes dual VIA Velocity VT6130 Gigabit Ethernet controllers via two RJ45 ports, supporting Wake On LAN and PXE features. Storage support includes two on-board S-ATA ports and one compact flash socket with HD audio provided through the VIA Vinyl VT1708B HD audio codec. Two USB 2.0 ports are provided on front panel I/O with an additional four available via pin headers.
Four flexible on-board serial ports include support for two RS-232/422/485 ports, selectable without jumpers through the BIOS, while a PS/2 compatible bi-directional parallel port is available through pin headers. Status lights include power and HDD activity. A programmable WatchDog timer is also included.
Samples of the EITX-3000 will be available to project customers in early May 2009. For more product details please visit:
http://www.via.com.tw/en/products/mainboards/motherboards.jsp?motherboard_id=810
About the Em-ITX Form Factor
The VIA developed Em-ITX form factor is the first form factor specification to specify dual I/O coastlines making it ideally suited to the development of ultra-slim embedded devices. Measuring 12cm x 17cm, both 17cm edges provide extensive space for an array of I/O options. This unique design greatly reduces cable clutter, facilitating thinner, more compact designs while also boosting signal integrity and improving airflow.
To learn more about the Em-ITX form factor please visit: http://www.via.com.tw/en/initiatives/spearhead/em-itx/
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
