Intel isn’t the world’s largest processor maker for nothing. The company has been in the lead when it comes to manufacturing technologies and has an arsenal of factories to make competitors shake in fear. Intel has taken a great leap forward now when it announced that the coming D1X plant will handle 450mm wafers.
The majority of semiconductors is made with 300mm wafers. By increasing the size more circuits fits on the wafter and reduce the spill per wafer. All for a more cost efficient manufacturing process, but it also requires new technology and machines to work.
Today three major semiconductor manufacturers are working to get 450mm wafers, beside Intel there is Samsung and Taiwan Semiconductor Manufacturing Company (TSMC). These plans are not expected to launch in the coming five years and the number of customers are very limited. Even if Intel says that it will be able to make circuits at a lower cost critics claim that the new technology will instead result in higher ambient costs since it requires higher manufacturing quality to maintain margins.
Intel D1X will be built in Oregon, USA and will start operating in 2013 with Research and Development, but will be prepared for 450mm manfuacturing according to Intel.
“Intel is very interested in 450-mm,” said Mark Bohr, Intel Senior Fellow and director of process architecture and integration at Intel. ”D1X is being (contructed) to be compatible with 450-mm.”
Exactly when the 450mm wafers will start rolling out wasn’t mentioned, but as usual Intel will be in the leading group when it does happen.
Source: Eetimes
