Chip maker AMD will launch a new mid-range family of Fusion APU processors this Summer. Under the code name Llano the APUs comes with integrated graphics to be paired with new chipsets that has now become the first to be certified for USB 3.0, which means motherboard makers won’t have to use discrete controllers.
AMD recently got two of its coming chipsets listed at USB-IF under the USB 3.0 certification program and one of them is A75 FCH, also known as Hudson D3. AMD will pair the new chipset with Llano APU on the mid-range circuit and looks to become the first chipset on the market to support the popular USB 3.0 interface natively.
AMD also received USB 3.0 certification for the A70M FCH chipset, also known as Hudson-M3, which will be used in mobile and energy efficient platforms such as notebooks and nettops. The USB 3.0 functionality that has been baked into the chipset was developed together with Renesas and will ffer four USB 3.0 outputs, with no need for discrete chips.
AMD Hudson-D3 will also offer six SATA 6.0 Gbps ports, RAID 0,1,10, Gigabit Ethernet and an integrated SD memory card controller.
AMD Llano will use two to four CPU cores based on the AMD Stars architecture. The CPU cores will be an optimized version the current Phenom II architecture but will be paired with an integrated graphics processor sporting up to 400 stream processors and DirectX 11 support. AMD A series, Llanos retail name, will also house a dual-channel DDR3-1866 controller and AMD Turbo Core functionality. The platform will use AMD’s coming FM1 socket.
Source: Expreview
