Intel has stated that the successor to the soon to be announced Centrino 2 platform, also known as Montevina, will be Calpella, or Centrino 3. The platform should arrive sometime mid-09 and will sport the then new and fresh mobile chips based on the 45nm Nehalem architecture. These processors will also be the first mobile processors from Intel to incorporate a GPU core inside of the CPU. Intel will further optimize the platform for power efficiency, which means that it will become even more modular and allow even smaller more distinct parts to power down and save energy. The details are sparse at the moment.
