G.Skill has announced a new memory heatspreader and a whole bunch of both high-end and mid-range memory kits using it. The new heatspreader is called ‘Pi’ (π) and was designed to increase the size and contact surface by up to 100%, says G.Skill. These aluminum creations will lower the temperatures of the chips by between 20% to 30%, compared to the run of the mill heatspreader.
Below is a list of the new memory kits using the Pi heatspreader which G.Skill has announced at the same time;
F2-6400CL4D-2GBPI: DDR2-800 4-4-4-12 1GBx2 kit
F2-8000CL5D-2GBPI: DDR2-1000 5-5-5-15 1GBx2 kit
F2-8500CL5D-2GBPI: DDR2-1066 5-5-5-15 1GBx2 kit
F2-6400CL5D-4GBPI: DDR2-800 5-5-5-15 2GBx2 kit
F2-6400CL4D-4GBPI: DDR2-800 4-4-4-12 2GBx2 kit
F2-8000CL5D-4GBPI: DDR2-1000 5-5-5-15 2GBx2 kit
F2-8500CL5D-4GBPI: DDR2-1066 5-5-5-15 2GBx2 kit
F3-10600CL8D-2GBPI: DDR3-1333 8-8-8-21 1GBx2 kit
F3-10600CL8D-4GBPI: DDR3-1333 8-8-8-21 2GBx2 kit
F3-10600CL7D-2GBPI: DDR3-1333 7-7-7-18 1GBx2 kit
F3-10600CL7D-4GBPI: DDR3-1333 7-7-7-18 2GBx2 kit
F3-12800CL7D-2GBPI: DDR3-1600 7-7-7-18 1GBx2 kit
F3-12800CL7D-4GBPI: DDR3-1600 7-7-7-18 2GBx2 kit
