VIA Isaiah will be officially unveiled at the end of the month, and it’s been said from the first announcement that VIA will release a dual-core version later on. No specific date has been given, but some stories claimed a launch already before the end of the year. Isaiah will initially be made at Fujitsu’s plant with its 65mn node, but in late 2009, VIA is expected to transition to 45nm and introduce the new dual-core Isaiah to the market, according to DigiTimes. Preliminary benchmarks comparing Isaiah to Intel’s coming Atom CPU showed much promise and since VIA has striven to make Isaiah pin-compatible with its older C7 CPUs, we should see a fairly quick market adoption.
