Memorysolutions has now announced that it has launched modules based on Optimum Care Internationally Tech’s TCSP technology (Turbo Chip Scale Package). The new technology has been develop to overcome some of the limitations of both TSOP (Thin Small Outline package) and BGA (Ball Grid Array), mainly physical limitations, but also reduce noise and crosstalk. The new technology also makes heatspreaders redundant, which means that Memorysolutions will reintroduce the naked memory modules, including in the high performance segment.
The young technology hasn’t been mastered to perfection though, which means that the first models aren’t perhaps the most impressive; DDR2-533 and DDR2-800 with 5-5-5-15 latencies, but it seems very promising as both OCI and Memorysolutions are planning to launch modules with tighter latencies, higher frequencies and better capacities later this year.
