USB as we know it is the best spread and most used standard for external storage media, keyboard, mice, web cameras, speakers, and other peripherals. The organization is now working on a new standard based on USB to be used for connecting circuits in various electronics.
The new USB standard will work like AMD’s HyperTransport and Intels QuickPath Interconnect to connect different circuits in a unit and get them to communicate. E.g. these two technologies from AMD and Intel gets southbridge, northbridge and processors to talk to each other. the new standrad is called SuperSpeed Inter-Chip and is based on USB 3.0, also known as SuperSpeed USB.
What SuperSpeed Inter-Chip will offer is a fast serial interface with a bandwidth at 2.9 Gb/s to 5.8 Gb/s with less pins and better energy efficiency than today. The technology will thus be cheaper to implement in various units and may very well be an attractive alternative for smartphones.
Source: SemiAccurate
