VIA has announced a new platform, VIA IVP-7500, designed for integrators of next-generation car PCs and intelligent transportation systems. Very much alike the Atom-based system that Intel announced a while back. VIA IVP-7500 measures 114mm x 185.5mm, sports an 1.0GHz VIA Eden ULV processor and the VIA CX700M2 Unified Digital Media IGP chipset (UniChrome Pro II). There is also up to 1GB DDR2 system memory, IDE 1.8” hard drive support with FFC and SD card support, HD audio and a range of display outputs.
Press release after the break;
New VIA In-Vehicle Platform for Driving Next-Generation Car PCs
VIA IVP-7500 board with advanced multimedia features offers system integrators the perfect in-vehicle PC platform
Taipei, Taiwan, 19 March 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today released the VIA IVP-7500 board, the first in a series of dedicated x86 in-vehicle platforms for developers of car PCs and intelligent transportation devices.
The continued evolution of the PC as a multimedia playback device for audio and video entertainment means that car owners are now demanding access to their digital media library whilst on the road. In-vehicle PCs offer access to intelligent global satellite positioning services for accurate location tracking, route planning and navigation.
Today’s cutting-edge consumer can employ in-car mounted cameras for video assisted parking and highway surveillance recording, while commercial customers can have access to license plate recognition, fleet management, digital tachograph, odometer and security applications.
Designed from the ground up for the rigours of in-vehicle computing, the VIA IVP-7500 is a versatile, scalable and highly power-efficient processor platform with strong multimedia performance. Customers have the option of fanless design implementations for industrial and grade stability. The flexible VIA IVP-7500 measures 114mm x 185.5mm and can be employed in a variety of dashboard implementations, including one or two DIN designs as well as discrete, in-seat and headrest designs.
“Intelligent transportation devices are making the transition from an enthusiast to mainstream audience,” said Daniel Wu, Vice President, VIA Embedded, VIA Technologies, Inc. “The VIA IVP-7500 carries our expertise in developing stable, compact, energy-efficient systems to this high-growth sector, bringing with it faster product development cycles and the flexibility to offer consumers more than just a car PC.”
About the VIA IVP-7500 Board
The VIA IVP-7500 is powered by a fanless 1.0GHz VIA Eden processor and supports up to 1GB of DDR2 system memory. A range of display technologies are supported including an LCD (TTL) panel interface, TV-out and VGA outputs and camera ports including A/V (via mini-USB) and V-CAM for monitoring applications.
Storage includes IDE 1.8” hard drive support with FFC cable and SD card support. HD audio is provided with optional SPK (R+L) and Mic-in connectors.
Communications technologies include a GPS module with IPEX antenna, an FM stereo transmitter and Bluetooth. Two USB 2.0 ports plus a COM port are included as well as an infra red adapter for hands-free applications.
VIA is currently offering samples of the VIA IVP-7500 board to project customers. For more information please visit:
http://www.via.com.tw/en/products/mainboards/motherboards.jsp?motherboard_id=790
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
Specification
If you have questions about the model names; please refer to the Model Name Definition for EPIA/VB boards.
| VIA IVP-7500 Specifications | |
| Model Name | IVP-7500-10 |
| Processor | 1.0GHz VIA Eden ULV CPU |
| Chipset | VIA CX700M2 Unified Digital Media IGP chipset |
| System Memory | 1 x DDR2 533/400 SODIMM socket Up to 1GB memory size, ECC support for DDR2 400 |
| VGA / LCD Panel | Integrated VIA UniChrome™ Pro II 3D/2D AGP graphics with MPEG-2/4 and WMV9 video decoding acceleration |
| Onboard IDE | 1 x UltraDMA 133/100/66/33 with FFC connector (for 1.8″ HDD) |
| Onboard Video | 1 x TV-out 1 x V-CAM jack 1 x A/V in 1 x IR receiver |
| Onboard GPS | 1 x LeadTek LR9102/LP GPS module Through COM2 I/F with external antenna (I-PEX) |
| Onboard Bluetooth | 1 x QCOM Bluetooth module through USB |
| Onboard FM Transmitter | NS73M61AU, FM transmission frequency from 87.5 to 108.0 MHz |
| Onboard Audio | VIA VT1708B High Definition Audio Codec |
| Onboard I/O Connectors | 1 x TV-out 1 x V-CAM jack 1 x A/V in 1 x VGA pin header 1 x LCD panel (TTL) connector 1 x COM port pin header 1 x Audio jack for Line-out 1 x IR receiver pin header 2 x USB 2.0 ports 1 x USB 2.0 pin header 1 x HDD connector, FFC type, for 1.8″ HDD 1 x CPU fan pin connector 1 x +12V DC-in 3-pin (battery) 1 x +12V DC-in jack (power adapter) 1 x Power ON/OFF switch |
| BIOS | Award BIOS, 4/8Mbit flash ROM |
| Operating System | Windows XP Embedded, Linux, Win CE |
| System Monitoring & Management | System power management |
| Operating Temperature | 0°C ~ 60°C |
| Operating Humidity | 0% ~ 95% (relative humidity; non-condensing) |
| Form Factor | Proprietary size (8-layer) 11.4 cm x 18.6 cm |
* The specification is subject to change without prior notice.
