As Transcend’s highest density DDR3 module, the 8GB DDR3-1066 RDIMM is constructed with a robust ten-layer PCB that offers stable performance and durability, and also includes a high thermal efficiency aluminum heat sink to help maintain cool temperatures under load. Offering memory bandwidth up to 8.5GB/s and the flexibility to expand maximum capacity to 48GB (per processor), the 8GB DDR3-1066 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.
Small yet powerful, Transcend’s 4GB DDR3-1333 VLP RDIMM is a mere 0.74 inches high-compact enough to fit into space-restricted cases, 1U height rack systems or blade servers. When used with the triple-channel architecture built into Intel’s newest Nehalem-based Xeon server platforms, Transcend’s DDR3-1333 VLP RDIMMs enable system administrators to maximize memory bandwidth, providing up to 10.6GB/s for optimal application performance.
All of Transcend’s DDR3-1333/1066 RDIMMs fully comply with JEDEC (Joint Electron Device Engineering Council) standards and are built with 256Mx8 high-quality DDR3 FBGA chips for their improved electrical and heat dissipation characteristics. Backed by Transcend’s lifetime warranty, these new DDR3 RDIMM modules offer unparalleled reliability for high-end servers and heavily loaded workstations.
Part Number Capacity Description Note
TS1GKR72V1N 8GB 1066MHz DDR3 REG DIMM(Quad Rank, x8) with thermal sensor
TS512MKR72V3NL 4GB 1333MHz DDR3 VLP REG DIMM(Dual Rank, x8) with thermal sensor