Samsung has announced that it has developed a technology which will make it possible to increase the amount of memory with flash-based storage solutions. With the help of the new technology it will be able to create memories at up to 16GB by using 16 8Gb chips. It has managed to do this by combining several breakthroughs, which include thinner wafers as a critical step. Samsung has managed to reduce the thickness of the wafer to only 30 μm. It all comes down to the fact that the circuits are stacked vertically and at the same time only need connectors on one side of the circuit.
