VIA looks to follow the AMD’s example when it comes to developing multi-core processors. Intel has a tendency to try the market with separate dies before joining them by the silicon. AMD often boasts about its monolithic circuits where are all cores and components are inside a single die. Now that VIA us preparing a dual-core CPU it turns out it will also be a single-die design, even though previous rumors stated the contrary.
VIA is planning to launch the new Nano processor for the mobile market and with 40 nanometer technology it hopes to get an extra energy efficient architecture. The new dual-core Nano processor is expected to go head to head with Intel Atom and target netbooks, where previous VIA processors can also be found.
During Computex 2010 the company is expected to release more information on the new CPU and hopefully some benchmarks and detailed specifications.
