Intel, HP, Microsoft Corporation, NEC Corporation, NXP Semiconductors, and Texas Instruments Incorporated have formed the USB 3.0 Promoter Group in an attempt to create a USB interface that sports up to ten times the speed of today’s interfaces. The purpose of the interface is of course the same of today’s USB 2.0, and other similar connections, but be better adapted to the modern people on the go where files up to and beyond several gigabytes are quite common. USB 3.0 will of course be backwards compatible, but also optimized for lower power consumption and protocol efficiency.
In short, USB 3.0 will be everything USB 2.0 is, but much better. The final specification is expected to be announced during the first half of 2008, and the first implementations are expected shortly afterward, but mainly as discrete silicon at first.
“The USB 3.0 Promoter Group is committed to preserving the existing USB device class driver infrastructure and investment, look-and-feel and ease-of-use of USB while continuing to expand this great technology’s capabilities.”
